Rigid PCB Technical Capabilities
Technical Capabilities (All values are in mm)
| Specification | Value |
|---|---|
| Maximum No. of Layers | 24 |
| Maximum Board Thickness | 3.20 |
| Minimum Finished Board Thickness | 0.20 (No HAL / Masking) |
Maximum Board Size(L x W) (All values are in mm)
| Material | Value |
|---|---|
| FR4 |
430 x 585 (For SS & DS) 420 x 570 (For multi layers) |
| Rogers | 435 x 275 |
| Itera | 430 x 585 |
| MCPCB | 430 x 585 |
Base Materials
| Specification | Value |
|---|---|
| Base Material | FR4 |
| Inner Layer Copper Cladding | |
| * Max. Cu Wt. for Planes (Oz.) | 2 |
| * Max. Cu Wt. for Signals (Oz.) | 2 |
| * Min. Cu Wt. (Oz.) | 0.5 |
| Outer Layer Copper Clading | |
| * Max Cu Wt. (Oz.) | 3 |
| * Min Cu Wt. (Oz.) | 0.5 |
Circuit Layers (All values are in mm)
| Specification | Value | ||
|---|---|---|---|
| For Start Copper Thickness of 0.5 Oz. | |||
| For Outer Layer | Minimum Track Width | 0.09 | |
| For Outer Layer | Minimum Spacing | 0.09 | |
| For Inner Layer | Minimum Track Width | 0.125 | |
| For Inner Layer | Minimum Spacing | 0.125 | |
| For Start Copper Thickness of 1.0 Oz. | |||
| Minimum Track Width | 0.15 | ||
| Minimum Spacing | 0.15 | ||
| For Start Copper Thickness of 2.0 Oz. | |||
| Minimum Track Width | 0.175 | ||
| Minimum Spacing | 0.20 | ||
Drilling (All values are in mm)
| Specification | Value |
|---|---|
| Minimum Finished Via Hole Size | 0.10 |
| Minimum Via Pad Size | |
| Outer Layers | 0.40 |
| Inner Layers | 0.45 |
| Minimum Annular Ring | 0.10 |
| Drill to Drill Clearance | 0.15 |
| Minimum Slot Size for PTH Slots (Tool Size) | 0.50 |
| Blind & Buried Vias Manufacturable | Yes |
| Drill to Track Clearance for Inner Layers (Upto 6 Layer) | 0.20 |
| Drill to Track Clearance for Inner Layers (>6 Layer) | 0.25 |
| Minimum Drill Size for Plated Holes on Board Edge | 0.60 |
| Minimum Drill to Drill Clearance for Plated Holes on Board Edge | 0.20 |
Blind Vias Capabilities
| Specification | Details |
|---|---|
| Maximum Supported Layers | Up to 24 layers with a maximum of 3 press cycles. (Extra press cycle refers to an additional step required for drilling blind or buried vias post lamination) |
| Maximum No. of Blind Vias Supported | Maximum 3 press cycles. |
| Via Size and Annular Ring | - Min: 0.20 mm tool, 0.10 mm finished with 0.125 mm ring. - Max: 0.30 mm finished maintaining 1:8 aspect ratio. |
| Supported Blind Via Types | We support only through drilling, no depth or laser drilling. |
Surface Finish
| Specification | Value | |
|---|---|---|
| HASL (Pb-Sn) | 1 - 25 microns. | |
| HASL (Lead Free) | NA | |
| Immersion Tin | NA | |
| Electrolytic Nickel Gold (Hard Gold) | Gold thickness minimum 0.5 microns. Nickel thickness 3-6 microns. |
|
| Electroless Nickel Immersion Gold (ENIG) | Gold thickness minimum 0.04 microns. Nickel thickness 3-6 microns. |
|
| Any Lead Free | NA | |
| No Copper | NA | |
| Only Copper | NA | |
Layer construction Impedance Design (All values are in mm)
| Specification | Value |
|---|---|
| Minimum Core Thickness | 0.10 |
| Minimum Possible Dielectric Thickness | 0.10 |
| Controlled Impedance Measurement | Yes |
Solder Mask (All values are in mm)
| Specification | Value |
|---|---|
| Mask Opening | |
| Green & Blue Masking | 0.06 |
| Minimum Soldermask Web Width Between Pads | 0.08 |
| Mask Opening | |
| Other Than Green & Blue Masking | 0.10 |
| Minimum Soldermask Web Width Between Pads | 0.120 |
| SM to Trace Clearance | 0.10 |
Legend (All values are in mm)
| Specification | Value |
|---|---|
| Legend Line Width | 0.10 |
| Minimum Character Height | 1.00 |
Scoring
| Specification | Value |
|---|---|
| Angle for V-cut | 30 degree |
| Jump Scoring | Yes |
Routing (All values are in mm)
| Specification | Value |
|---|---|
| Minimum Router Size | 0.50 |
Copper Clearance from PCB Edge (All values are in mm)
| Specification | Value |
|---|---|
| For Routing | |
| For Inner Layer | 0.25 |
| For Outer Layer | 0.20 |
| For Scoring | |
| For Inner Layer | 0.45 |
| For Outer Layer | 0.40 |
Via Filling
| Specification | Value |
|---|---|
| Via Fill Maximum Drill Size | 0.35 |
| Via Filling Method | We provide via filling with non-conductive solder mask ink, suitable for HDI and BGA applications. |
Carbon (All values are in mm)
| Specification | Value |
|---|---|
| Minimum Line Width | 0.30 |
| Minimum Carbon – Carbon Spacing | 0.25 |
Peelable (All values are in mm)
| Specification | Value |
|---|---|
| Minimum Width of Any Peel-off Element | 0.50 |
| Maximum Coverable Hole ENDSIZE | 6.00 |
| Minimum Overlap on Copper Pattern | 0.254 |
| Minimum Clearance to Free Copper | 0.254 |
| Minimum Distance from PCB Outline | 0.50 |
Drill Tolerances (All values are in mm)
| PTH Hole Size | PTH Tolerance | NPTH Hole Size | NPTH Tolerance |
|---|---|---|---|
| 0.50-3.50 | +/- 0.10 | 0.50-3.50 | +/- 0.10 |
| >3.50 | +/- 0.15 | >3.50 | +/- 0.15 |
Other Tolerances
| PCB Size | PCB Thickness | Trace Width / Spacing | Copper Thickness Inside Hole | Bow & Twist Tolerance |
|---|---|---|---|---|
| +/- 0.20 mm | +/- 20% (Up to 0.8 mm thickness) | +/- 20 % | >= 0.020 | +/- 1% |
| +/- 10% (Above 1.0 mm thickness) |
Available Finishes
| RoHS Compliances Finishes | Non-RoHS Finish |
|---|---|
| Lead Free HAL | HAL(sn PB) |
| Immersion Tin | - |
| Electroless Nickel Immerssion Gold (0.075-0.1 um AU + 3-5 um Ni) | - |
Legend Colours
| Color | Value |
|---|---|
| White | Yes |
| Black | Yes |
| Yellow | Yes |
Solder Mask Colours
| Color | Value |
|---|---|
| Green | Yes |
| Black | Yes |
| White | Yes |
| Blue | Yes |
| Red | Yes |
| Purple | Yes |
| Yellow | Yes |
| Orange | Yes |
Technologies
| Specification | Value |
|---|---|
| Impedance Control | Yes |
| Blind / Buried Vias | Yes |
| Carbon Printing | Yes |
| Hard Gold Tabs | Yes |
| Peelable Solder Mask | Yes |
