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Rigid PCB Technical Capabilities

Technical Capabilities (All values are in mm)

Specification Value
Maximum no. of Layers 24
Maximum Board Thickness 3.20
Minimum Finished Board Thickness 0.20 (No HAL / Masking)

Maximum Board Size(L x W) (All values are in mm)

Material Value
FR4 430 x 585 (For SS & DS)
420 x 570 (For Multi layers)
Rogers 435 x 275
Itera 430 x 585
MCPCB 430 x 585

Base Materials

Specification Value
Base Material FR4
Inner Layer Copper Cladding
* Max. Cu Wt. For Planes (Oz.) 2
* Max. Cu Wt. For Signals (Oz.) 2
* Min. Cu Wt. (Oz.) 0.5
Outer Layer Copper Clading
* Max Cu Wt. (Oz.) 3
* Min Cu Wt. (Oz.) 0.5

Circuit Layers (All values are in mm)

Specification Value
For Start Copper Thickness of 0.5 Oz.
For Outer Layer Minimum Track Width 0.09
For Outer Layer Minimum Spacing 0.09
For Inner Layer Minimum Track Width 0.125
For Inner Layer Minimum Spacing 0.125
For Start Copper Thickness of 1.0 Oz.
Minimum Track Width 0.15
Minimum Spacing 0.15
For Start Copper Thickness of 2.0 Oz.
Minimum Track Width 0.175
Minimum Spacing 0.20

Drilling (All values are in mm)

Specification Value
Minimum Finished via Hole Size 0.10
Minimum via Pad Size
Outer Layers 0.40
Inner Layers 0.45
Minimum Annular Ring 0.10
Drill to Drill Clearance 0.15
Minimum Slot Size For PTH Slots (Tool size) 0.50
Blind & Buried vias Manufacturable Yes
Drill to Track Clearance For Inner Layers (upto 6 layer) 0.20
Drill to Track Clearance for Inner Layers (>6 layer) 0.25
Minimum Drill Size For Plated Holes on Board Edge 0.60
Minimum Drill to Drill Clearance For Plated Holes on Board Edge 0.20

Blind Vias Capabilities

Specification Details
Maximum Supported Layers Up to 24 layers with a maximum of 3 press cycles.
(Extra press cycle refers to an additional step required for drilling blind or buried vias post lamination)
Maximum Number of Blind Vias Supported Maximum 3 press cycles.
Via Size and Annular Ring - Min: 0.20 mm tool, 0.10 mm finished with 0.125 mm ring.
- Max: 0.30 mm finished maintaining 1:8 aspect ratio.
Supported Blind Via Types We support only through drilling, no depth or laser drilling.

Surface Finish

Specification Value
HASL (Lead free & PB/Sn both) Yes
Electrolytic Gold Yes
Electroless Nickle / Gold Yes
Immersion Tin Yes

Layer construction Impedance Design (All values are in mm)

Specification Value
Minimum Core Thickness 0.10
Minimum Possible Dielectric Thickness 0.10
Controlled Impedance Measurement Yes

Solder Mask (All values are in mm)

Specification Value
Mask Opening
Green & Blue Masking 0.06
Minimum Soldermask Web Width Between Pads 0.08
Mask Opening
Other than Green & Blue Masking 0.10
Minimum Soldermask Web Width Between Pads 0.120
SM to Trace Clearance 0.10
Via Fill Maximum Drill Size 0.35

Legend (All values are in mm)

Specification Value
Legend Line Width 0.10
Minimum Character Height 1.00

Scoring

Specification Value
Angle For v-cut 30 degree
Jump Scoring Yes

Routing (All values are in mm)

Specification Value
Minimum Router Size 0.50

Copper Clearance from PCB Edge (All values are in mm)

Specification Value
For Routing
For Inner Layer 0.25
For Outer Layer 0.20
For Scoring
For Inner Layer 0.45
For Outer Layer 0.40

Carbon (All values are in mm)

Specification Value
Minimum Line Width 0.30
Minimum Carbon – Carbon Spacing 0.25

Peelable (All values are in mm)

Specification Value
Minimum Width of Any Peel-off Element 0.50
Maximum Coverable Hole ENDSIZE 6.00
Minimum Overlap on Copper Pattern 0.254
Minimum Clearance to Free Copper 0.254
Minimum Distance From PCB Outline 0.50

Drill Tolerances (All values are in mm)

PTH Hole Size PTH Tolerance NPTH Hole Size NPTH Tolerance
0.50-3.50 +/- 0.10 0.50-3.50 +/- 0.10
>3.50 +/- 0.15 >3.50 +/- 0.15

Other Tolerances

PCB Size PCB Thickness Trace Width / Spacing Copper Thickness Inside Hole Bow & twist tolerance
+/- 0.20 mm +/- 20% (Up to 0.8 mm thickness) +/- 20 % >= 0.020 +/- 1%
+/- 10% (Above 1.0 mm thickness)

Available Finishes

RoHS Compliances finishes Non-RoHS Finish
Lead Free HAL HAL(sn PB)
Immersion Tin -
Electroless Nickel Immerssion Gold (0.075-0.1 um AU + 3-5 um Ni) -

Legend Colours

Color Value
White Yes
Black Yes
Yellow Yes

Solder Mask Colours

Color Value
Green Yes
Black Yes
White Yes
Blue Yes
Red Yes
Purple Yes
Yellow Yes
Orange Yes

Technologies

Specification Value
Impedance Control Yes
Blind / Buried Vias Yes
Carbon Printing Yes
Hard Gold Tabs Yes
Peelable Solder Mask Yes
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