Rigid PCB Technical Capabilities
Technical Capabilities (All values are in mm)
Specification | Value |
---|---|
Maximum no. of Layers | 24 |
Maximum Board Thickness | 3.20 |
Minimum Finished Board Thickness | 0.20 (No HAL / Masking) |
Maximum Board Size(L x W) (All values are in mm)
Material | Value |
---|---|
FR4 |
430 x 585 (For SS & DS) 420 x 570 (For Multi layers) |
Rogers | 435 x 275 |
Itera | 430 x 585 |
MCPCB | 430 x 585 |
Base Materials
Specification | Value |
---|---|
Base Material | FR4 |
Inner Layer Copper Cladding | |
* Max. Cu Wt. For Planes (Oz.) | 2 |
* Max. Cu Wt. For Signals (Oz.) | 2 |
* Min. Cu Wt. (Oz.) | 0.5 |
Outer Layer Copper Clading | |
* Max Cu Wt. (Oz.) | 3 |
* Min Cu Wt. (Oz.) | 0.5 |
Circuit Layers (All values are in mm)
Specification | Value | ||
---|---|---|---|
For Start Copper Thickness of 0.5 Oz. | |||
For Outer Layer | Minimum Track Width | 0.09 | |
For Outer Layer | Minimum Spacing | 0.09 | |
For Inner Layer | Minimum Track Width | 0.125 | |
For Inner Layer | Minimum Spacing | 0.125 | |
For Start Copper Thickness of 1.0 Oz. | |||
Minimum Track Width | 0.15 | ||
Minimum Spacing | 0.15 | ||
For Start Copper Thickness of 2.0 Oz. | |||
Minimum Track Width | 0.175 | ||
Minimum Spacing | 0.20 |
Drilling (All values are in mm)
Specification | Value |
---|---|
Minimum Finished via Hole Size | 0.10 |
Minimum via Pad Size | |
Outer Layers | 0.40 |
Inner Layers | 0.45 |
Minimum Annular Ring | 0.10 |
Drill to Drill Clearance | 0.15 |
Minimum Slot Size For PTH Slots (Tool size) | 0.50 |
Blind & Buried vias Manufacturable | Yes |
Drill to Track Clearance For Inner Layers (upto 6 layer) | 0.20 |
Drill to Track Clearance for Inner Layers (>6 layer) | 0.25 |
Minimum Drill Size For Plated Holes on Board Edge | 0.60 |
Minimum Drill to Drill Clearance For Plated Holes on Board Edge | 0.20 |
Blind Vias Capabilities
Specification | Details |
---|---|
Maximum Supported Layers | Up to 24 layers with a maximum of 3 press cycles. (Extra press cycle refers to an additional step required for drilling blind or buried vias post lamination) |
Maximum Number of Blind Vias Supported | Maximum 3 press cycles. |
Via Size and Annular Ring | - Min: 0.20 mm tool, 0.10 mm finished with 0.125 mm ring. - Max: 0.30 mm finished maintaining 1:8 aspect ratio. |
Supported Blind Via Types | We support only through drilling, no depth or laser drilling. |
Surface Finish
Specification | Value |
---|---|
HASL (Lead free & PB/Sn both) | Yes |
Electrolytic Gold | Yes |
Electroless Nickle / Gold | Yes |
Immersion Tin | Yes |
Layer construction Impedance Design (All values are in mm)
Specification | Value |
---|---|
Minimum Core Thickness | 0.10 |
Minimum Possible Dielectric Thickness | 0.10 |
Controlled Impedance Measurement | Yes |
Solder Mask (All values are in mm)
Specification | Value |
---|---|
Mask Opening | |
Green & Blue Masking | 0.06 |
Minimum Soldermask Web Width Between Pads | 0.08 |
Mask Opening | |
Other than Green & Blue Masking | 0.10 |
Minimum Soldermask Web Width Between Pads | 0.120 |
SM to Trace Clearance | 0.10 |
Via Fill Maximum Drill Size | 0.35 |
Legend (All values are in mm)
Specification | Value |
---|---|
Legend Line Width | 0.10 |
Minimum Character Height | 1.00 |
Scoring
Specification | Value |
---|---|
Angle For v-cut | 30 degree |
Jump Scoring | Yes |
Routing (All values are in mm)
Specification | Value |
---|---|
Minimum Router Size | 0.50 |
Copper Clearance from PCB Edge (All values are in mm)
Specification | Value |
---|---|
For Routing | |
For Inner Layer | 0.25 |
For Outer Layer | 0.20 |
For Scoring | |
For Inner Layer | 0.45 |
For Outer Layer | 0.40 |
Carbon (All values are in mm)
Specification | Value |
---|---|
Minimum Line Width | 0.30 |
Minimum Carbon – Carbon Spacing | 0.25 |
Peelable (All values are in mm)
Specification | Value |
---|---|
Minimum Width of Any Peel-off Element | 0.50 |
Maximum Coverable Hole ENDSIZE | 6.00 |
Minimum Overlap on Copper Pattern | 0.254 |
Minimum Clearance to Free Copper | 0.254 |
Minimum Distance From PCB Outline | 0.50 |
Drill Tolerances (All values are in mm)
PTH Hole Size | PTH Tolerance | NPTH Hole Size | NPTH Tolerance |
---|---|---|---|
0.50-3.50 | +/- 0.10 | 0.50-3.50 | +/- 0.10 |
>3.50 | +/- 0.15 | >3.50 | +/- 0.15 |
Other Tolerances
PCB Size | PCB Thickness | Trace Width / Spacing | Copper Thickness Inside Hole | Bow & twist tolerance |
---|---|---|---|---|
+/- 0.20 mm | +/- 20% (Up to 0.8 mm thickness) | +/- 20 % | >= 0.020 | +/- 1% |
+/- 10% (Above 1.0 mm thickness) |
Available Finishes
RoHS Compliances finishes | Non-RoHS Finish |
---|---|
Lead Free HAL | HAL(sn PB) |
Immersion Tin | - |
Electroless Nickel Immerssion Gold (0.075-0.1 um AU + 3-5 um Ni) | - |
Legend Colours
Color | Value |
---|---|
White | Yes |
Black | Yes |
Yellow | Yes |
Solder Mask Colours
Color | Value |
---|---|
Green | Yes |
Black | Yes |
White | Yes |
Blue | Yes |
Red | Yes |
Purple | Yes |
Yellow | Yes |
Orange | Yes |
Technologies
Specification | Value |
---|---|
Impedance Control | Yes |
Blind / Buried Vias | Yes |
Carbon Printing | Yes |
Hard Gold Tabs | Yes |
Peelable Solder Mask | Yes |