Rigid PCB Technical Capabilities

Technical Capabilities (All values are in mm)

Specification	Value
Maximum no. of Layers	24
Maximum Board Thickness	3.20
Minimum Finished Board Thickness	0.20 (No HAL / Masking)

Maximum Board Size(L x W) (All values are in mm)

Material	Value
FR4	430 x 585 (For SS & DS) 420 x 570 (For Multi layers)
Rogers	435 x 275
Itera	430 x 585
MCPCB	430 x 585

Base Materials

Specification	Value
Base Material	FR4
Inner Layer Copper Cladding
* Max. Cu Wt. For Planes (Oz.)	2
* Max. Cu Wt. For Signals (Oz.)	2
* Min. Cu Wt. (Oz.)	0.5
Outer Layer Copper Clading
* Max Cu Wt. (Oz.)	3
* Min Cu Wt. (Oz.)	0.5

Circuit Layers (All values are in mm)

Specification			Value
For Start Copper Thickness of 0.5 Oz.
For Outer Layer	Minimum Track Width		0.09
For Outer Layer	Minimum Spacing		0.09
For Inner Layer	Minimum Track Width		0.125
For Inner Layer	Minimum Spacing		0.125
For Start Copper Thickness of 1.0 Oz.
Minimum Track Width			0.15
Minimum Spacing			0.15
For Start Copper Thickness of 2.0 Oz.
Minimum Track Width			0.175
Minimum Spacing			0.20

Drilling (All values are in mm)

Specification	Value
Minimum Finished via Hole Size	0.10
Minimum via Pad Size
Outer Layers	0.40
Inner Layers	0.45
Minimum Annular Ring	0.10
Drill to Drill Clearance	0.15
Minimum Slot Size For PTH Slots (Tool size)	0.50
Blind & Buried vias Manufacturable	Yes
Drill to Track Clearance For Inner Layers (upto 6 layer)	0.20
Drill to Track Clearance for Inner Layers (>6 layer)	0.25
Minimum Drill Size For Plated Holes on Board Edge	0.60
Minimum Drill to Drill Clearance For Plated Holes on Board Edge	0.20

Blind Vias Capabilities

Specification	Details
Maximum Supported Layers	Up to 24 layers with a maximum of 3 press cycles. (Extra press cycle refers to an additional step required for drilling blind or buried vias post lamination)
Maximum Number of Blind Vias Supported	Maximum 3 press cycles.
Via Size and Annular Ring	- Min: 0.20 mm tool, 0.10 mm finished with 0.125 mm ring. - Max: 0.30 mm finished maintaining 1:8 aspect ratio.
Supported Blind Via Types	We support only through drilling, no depth or laser drilling.

Surface Finish

Specification	Value
HASL (Pb-Sn)	1 - 25 microns.
HASL (Lead Free)	NA
Immersion Tin	NA
Electrolytic Nickel Gold (Hard Gold)	Gold thickness minimum 0.5 microns. Nickel thickness 3-6 microns.
Electroless Nickel Immersion Gold (ENIG)	Gold thickness minimum 0.04 microns. Nickel thickness 3-6 microns.
Any Lead Free	NA
No Copper	NA
Only Copper	NA

Layer construction Impedance Design (All values are in mm)

Specification	Value
Minimum Core Thickness	0.10
Minimum Possible Dielectric Thickness	0.10
Controlled Impedance Measurement	Yes

Solder Mask (All values are in mm)

Specification	Value
Mask Opening
Green & Blue Masking	0.06
Minimum Soldermask Web Width Between Pads	0.08
Mask Opening
Other than Green & Blue Masking	0.10
Minimum Soldermask Web Width Between Pads	0.120
SM to Trace Clearance	0.10
Via Fill Maximum Drill Size	0.35

Legend (All values are in mm)

Specification	Value
Legend Line Width	0.10
Minimum Character Height	1.00

Scoring

Specification	Value
Angle For v-cut	30 degree
Jump Scoring	Yes

Routing (All values are in mm)

Specification	Value
Minimum Router Size	0.50

Copper Clearance from PCB Edge (All values are in mm)

Specification	Value
For Routing
For Inner Layer	0.25
For Outer Layer	0.20
For Scoring
For Inner Layer	0.45
For Outer Layer	0.40

Carbon (All values are in mm)

Specification	Value
Minimum Line Width	0.30
Minimum Carbon – Carbon Spacing	0.25

Peelable (All values are in mm)

Specification	Value
Minimum Width of Any Peel-off Element	0.50
Maximum Coverable Hole ENDSIZE	6.00
Minimum Overlap on Copper Pattern	0.254
Minimum Clearance to Free Copper	0.254
Minimum Distance From PCB Outline	0.50

Drill Tolerances (All values are in mm)

PTH Hole Size	PTH Tolerance	NPTH Hole Size	NPTH Tolerance
0.50-3.50	+/- 0.10	0.50-3.50	+/- 0.10
>3.50	+/- 0.15	>3.50	+/- 0.15

Other Tolerances

PCB Size	PCB Thickness	Trace Width / Spacing	Copper Thickness Inside Hole	Bow & twist tolerance
+/- 0.20 mm	+/- 20% (Up to 0.8 mm thickness)	+/- 20 %	>= 0.020	+/- 1%
	+/- 10% (Above 1.0 mm thickness)

Available Finishes

RoHS Compliances finishes	Non-RoHS Finish
Lead Free HAL	HAL(sn PB)
Immersion Tin	-
Electroless Nickel Immerssion Gold (0.075-0.1 um AU + 3-5 um Ni)	-

Legend Colours

Color	Value
White	Yes
Black	Yes
Yellow	Yes

Solder Mask Colours

Color	Value
Green	Yes
Black	Yes
White	Yes
Blue	Yes
Red	Yes
Purple	Yes
Yellow	Yes
Orange	Yes

Technologies

Specification	Value
Impedance Control	Yes
Blind / Buried Vias	Yes
Carbon Printing	Yes
Hard Gold Tabs	Yes
Peelable Solder Mask	Yes